Electroplated diamond wire saws are widely used for cutting high-value materials such as solar silicon wafers, LEDs, semiconductors, gemstones, magnetic materials, and optical glass. These saws offer significant advantages, including high cutting efficiency, precision, and environmental friendliness. With advancements in diamond wire saw technology, particularly in the photovoltaic silicon cutting industry, diamond wire saws have completely replaced traditional silicon carbide slurry cutting methods, greatly enhancing cutting speed and quality, and driving rapid growth in the solar industry.
Electroplated diamond wire saws are made by bonding diamond abrasives to a core wire using electroplated metal as a binder. The stability and quality of these wire saws are influenced by several factors, including diamond micro powder (abrasive), bare wire, and the electroplating process. Among these, diamond micro powder is a critical factor affecting the performance and quality stability of the wire saw.
Definition and Characteristics of Diamond Micro Powder
Diamond micro powder consists of tiny diamond particles ranging from 1 to 100 micrometers, typically produced by crushing coarse single crystal diamond grains, referred to as crushed micro powder. This manufacturing process is straightforward, high-yield, and widely used in the production of diamond wire saws.
The inherent characteristics required for diamond micro powder in wire saw production primarily include three aspects: particle size, shape, and strength:
- Particle Size: This includes particle size distribution, average particle diameter, and other relevant parameters. Clearly defined particle sizes are essential for effective application.
- Particle Shape: The shape parameters, such as roundness and ellipticity, directly influence the electroplating process and overall performance. If the micro powder’s particle shape is incompatible with the electroplating process or operating conditions, achieving optimal results becomes difficult.
- Particle Strength: The strength of crushed micro powder is closely related to the strength of the original single crystal diamond material. Higher original strength results in stronger micro powder. Low-strength micro powder leads to poor cutting performance and durability, resulting in unstable products.
Choosing Diamond Micro Powder
Micro Powder Particle Size: When selecting diamond micro powder for wire saws, focus on average particle size, size composition, and distribution characteristics. The average particle size is a primary indicator, typically represented by the d50 value.
The Issue of Large Particles: Large particles within the micro powder are a "fatal flaw." No matter how well other characteristics measure up, the presence of large particles renders the micro powder unusable. In wire saw applications, large particles can cause scratches on the workpiece during cutting.
Particle Shape: Diamond micro powder comprises various shaped particles. The shape directly affects the coating on diamond surfaces, the electroplating process of the wire saw, and its performance. The production process determines particle shape, and pre-selection typically includes shaping to remove irregular particles, facilitating better sorting and application. Roundness is a commonly used parameter to characterize particle shape.
Strength: The strength of diamond micro powder significantly impacts the performance and durability of wire saws. Higher strength correlates with better cutting capability and stability in quality. The strength of micro powder is primarily dependent on the strength of the raw material, often tested using impact toughness (T) or thermal impact toughness (TTI).
